BEGIN:VCALENDAR VERSION:1.0 BEGIN:VEVENT SUMMARY:Advanced Packaginng using Flip Chip Technology DESCRIPTION;ENCODING=QUOTED-PRINTABLE:"Advanced Packaginng using Flip Chip Technology" IEEE. Moses Chan, Vitesse. Flip chip technology provides excellent capabilities to fulfill today's needs of cost and performance. This presentation would examine some of the challenges and considerations in packaging flip chip devices. The advantages of flip chip over wire bonded interconnect technology will be discussed. See http://www.ieee-buenaventura.org/ DTSTART:20051125T183000 DTEND:20051125T193000 END:VEVENT END:VCALENDAR