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Advanced Packaginng using Flip Chip Technology
Date: November 25, 2005
Location:Camarillo
"Advanced Packaginng using Flip Chip Technology" IEEE. Moses Chan, Vitesse. Flip chip technology provides excellent capabilities to fulfill today's needs of cost and performance. This presentation would examine some of the challenges and considerations in packaging flip chip devices. The advantages of flip chip over wire bonded interconnect technology will be discussed. See http://www.ieee-buenaventura.org/
More information: http://www.ieee-buenaventura.org/
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