San Diego-based Rayspan Corporation, a developer of advanced materials being used for wireless antennas and RF front-ends, disclosed this morning that it has raised $12.5M in a round from Khosla Ventures and Sequoia Capital. The Series B round was led by Khosla. According to Rayspan, the financing will go to accelerate and expand the development and commercialization of the firm's products. Rayspan has developed composite-based, advanced materials being used for WLAN and cellular handset antennas and RF front-end components. More information »